BSB03PA1x Module

Owned by Doug Alguire (Deactivated)
Last updated: Oct 28, 2019 by Tracy W (Deactivated)

NRND

This hardware is not recommended for new designs. It has been replaced by our CSB04PA1x Module.


This is a repository for files that will be helpful for a designer as they build products incorporating RapidConnect hardware. To view FAQs, tutorials, and resources related to firmware development and testing, see the Knowledge Base.

To learn more about common RF terminology, we recommend reviewing this external page.

Best Practices

The following best practices should be noted for all designs incorporating the RapidConnect module:

  1. Use the Hardware Design Resources (including the bottom layer gerbers for the RapidConnect module) to confirm that the module footprint has been correctly added to your board design.
  2. Include the pads for the appropriate programming/debug header, as shown in the RapidConnect module datasheet.
  3. Include debug connections to the UART serial connection between module and the host to examine serial messages going in and out of the module for debugging purposes. MMB recommends a standard 0.1" header to enable the use of an FTDI USB-to-UART cable.
  4. Confirm that your design adheres to the antenna keep out zone, as specified in the RapidConnect module datasheet.
  5. Confirm that there are no copper traces directly under the module.
  6. If your device includes a metallic enclosure, choose the U.FL version of the RapidConnect module so an external antenna can be used.

Resources

Types of Resources
On this page, you will find the following three types of resources:
  1. The Datasheet provides an overview of the electrical, mechanical, and RF characteristics of the module.
  2. The Land Pattern Reference Gerber is a gerber version of the PCB footprint, containing 3 files:
    1. Module Silkscreen outline (slightly larger than actual module for placement purposes)
    2. Copper pads for the PCB to which the module will be assembled, based on our data sheet land pattern
    3. Solder mask recommendation showing a 3 mil clearance around all sides of copper pads (our datasheet doesn't call this out but it's what we recommend, based on IPC specs).
  3. The Module Pad and Drill Gerber is a reference partial gerber of the actual module, containing 3 files: 
    1. Module outline (exact module perimeter)
    2. Excellon drill file showing where vias are located on the bottom side of the module
    3. Bottom side copper pads and copper around via drills where there is a risk of exposure/shorting to the PCB where the module is attached. We recommend that a PCB containing this module footprint should not have any vias under the module. If that is unavoidable, the designer should try to ensure there are no vias that would line up with these copper areas on the module, and of course obey the RF keep out zone (not shown in gerber but referenced in datasheet)
  4. The Application Circuits demonstrate the correct implementation of the RapidConnect Module in conjunction with a Host Microcontroller or USB Transceiver.


  File Modified

ZIP Archive BSB03PA1x GBR Package.zip

Sept 07, 2017 by Doug Alguire (Deactivated)

PDF File Layout Guidelines for BSB03PA1x r0.3.pdf

Nov 27, 2017 by Doug Alguire (Deactivated)

Microsoft Powerpoint Presentation Soldering Instructions for Conducted RF Measurements - BSB03PA1X.pptx

Apr 10, 2018 by Doug Alguire (Deactivated)

PDF File BSB03PA1x Module Specification v1.1.pdf

Jun 25, 2018 by Doug Alguire (Deactivated)



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